Flux / soudure

CircuitWorks® Flux Dispensing Pens
Pen for applying flux with precision and control
• Chisel tip marker provides exact delivery of flux to surface
• Easily removed with appropriate CircuitWorks® Flux Remover Pen

 

No Clean Flux Dispensing Pen
• Applies a patented noncorrosive, halide free, no clean flux
• Flux meets Bellcore TR-N-NWT-000078 and IPC SF-818 for Surface Insulation Resistance
• Flux meets ANSI/IPC J-STD-004, Type ROL0

 

CW8100 13 g / 0.32 oz

 

Lead-Free Flux Dispensing Pen
• Applies a noncorrosive, halide free, no clean flux for high temperature, lead-free application
• Can also be used for tin/lead solders
• Flux meets Bellcore TR-N-NWT-000078 and IPC SF-818 for Surface Insulation Resistance
• Flux meets ANSI / IPC J-STD-004, Type ROL0
• Easily removed with Lead-Free Flux Remover Pen, or Flux-Off® Lead-Free Flux Remover

 

CW8400 9 g / 0.32 oz
CW8400BLK50 Box of 50 pens, 9 g each

 

Rosin Flux Dispensing Pen
• Applies a noncorrosive, nonconductive Type R flux
• Flux meets MIL-F-14256 F Type R and ANSI/IPC J-STD-004, Type ROL0

 

CW8200 9 g / 0.32 oz

 

Water Soluble Flux Dispensing Pen
• Applies a neutral pH organic water soluble flux for rapid soldering
• Flux meets ANSI/IPC J-STD-004, ORH1 Classification
• Easily removed with water or Flux-Off® Water Soluble

 

CW8300 9 g / 0.32 oz

 

CircuitWorks® Tacky Flux
Conveniently packaged flux gel formulated for easy SMT rework
• Formulated for No-Clean applications
• Syringe applicator provides exact delivery of flux
• Long tack time, extended shelf life
• No refrigeration required
• Noncorrosive, halide and halogen free
• Meets IPC requirements for ROL0, No Clean
• Conforms to ISO 9454
• Meets Bellcore TR-NWT-000078 requirements
• Meets DIN EN 29454-1 1.1.3.C classification

 

Lead-Free
CW8700 3.5 g / 0.12 oz

 

No-Clean
CW8500 3.5 g / 0.12 oz
770

 

CircuitWorks® Lead-Free Pocket Solder
Lead free, high purity pocket sized solder dispenser for convenient rework and repair
• SAC 305 for soldering lead-free applications
• 96.5% Tin (Sn), 3.0% Silver (Ag), 0.5% Copper (Cu)
• Type ROL0 flux per IPC J-STD-004
• Ensures even, reliable solder connections
• Cleans and wets heavily tarnished copper surfaces

 

S200 1.0 mm / 0.04" Diameter,
3.18 m / 125" Length

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